Ansys EMC Plus & Ansys Charge Plus : 25R2 What’s New

2025 R2 updates are now available for Ansys EMC Plus and Ansys Charge Plus. This release includes new functions in addition to performance and user experience updates.

Ansys EMC Plus

Ansys EMC Plus is a platform-level electromagnetic modeling and simulation tool that delivers a design-to-validation workflow for EMC. Application areas include electromagnetic environmental effects (E3), cables, electromagnetic interference/ electromagnetic compatibility (EMI/EMC), and radio frequency interference (RFI).

Headline new functions in 25R2 include:

  • Circuit at harness junctions

  • S-parameter post-processing in EMA3D Connect

  • Unit integration with Discovery length scales

Circuit at Harness Junctions

Users can now easily incorporate circuits directly at cable harness junctions. Simply select the desired junction and both conductors, press next, and they will appear in the circuit interface. Figure 1 shows this process.

S-parameter Post-Processing in EMA3D Connect

EMA has created a post-processing tool for S-parameters called EMA3D Connect. Parameters generated from simulations can be plotted in one chart allowing users to compare different results, transforming the tool into a customizable and flexible X-Y plotting solution. See how it works in Figure 2.

Support for Ansys Discovery Length Scales

Users needing to analyze sizeable models can now use large scale model units. A kilometer length scale is now available for projects such as analyzing coupling to railroad tracks. Length scales can be changed in Ansys Discovery settings in the units and display category, seen in Figure 3.

Fig. 3. New Discovery length scales settings

Ansys Charge Plus

Ansys Charge Plus combines electromagnetic solvers, fluid solvers, and particle physics solvers for easy-to-use multiphysics simulation. Application areas include space and radiation environment effects, discharge modeling, electrostatic discharge (ESD) testing, and plasma chambers.

Headline new functions in 25R2 include:

  • Radiation hardening workflow updates

  • Thin-layer materials

  • Flashover discharge simulation

Radiation Hardening Workflow Updates

Several updates have been made to the radiation hardening workflow in Charge Plus including:

  • The addition of scoring volume, or tallies, for transport simulations for all bodies

  • Running radiation transport simulations without the electromagnetic solver overhead

  • Running radiation transport simulations with only boundary elements, simplifying the meshing process by not requiring conformality at interfaces of bodies nor the generation of volume elements

  • Improved physics list for hadrons (neutrons/ions) and performance improvements for non-ionizing dose simulation

Additionally, two new meshing options have been added: Discovery 2D and Facets. Discovery 2D uses the native Discovery surface meshing without shared topology where Facets use CAD rending facets. These options significantly expand the complexity of models that can be simulated. Figure 4 shows the new facets option.

Thin Layer Materials/ Boundary Mesh Layers

A new material stack up tool has been added to define multi-layer materials too think to mesh efficiently in the mesh engine. This can be used to create boundary layers for vacuum in PIC and fluid simulations. It can also be integrated with transport code. The solver will automatically mesh thin layers materials and create bodies for each layer.

Figure 5 shows ionizing dose of an enclosure. The enclosure is on the top with 100 thin layers on the bottom with each layer about 10 nm thick.

Fig. 5. Ionizing dose results using thin layer materials capabilities.

Flashover and Surface Roughness Models

Model surface roughness with new E-field enhancement factors near surfaces with tangential and normal scaling in the stochastic tree model. A field enhancement factor can be added to mimic the effect of dust for creepage, humidity, or surface roughness applications.

This new feature combined with thin layers allows users to model flashovers on the surface of dielectrics. Figure 6 is a proof of concept on the surface of a high voltage power line insulator.

Performance Improvements

25R2 includes several performance and user experience updates. The main improvements include:

  • Simulation tree user updates

  • Materials workflow update from 25R1

  • Mesh rendering optimizations

  • Fluid/PIC refactor and simulation accelerations with reduced memory overhead

  • Parallelized file writing from multi-node HPC simulations in TD-FEM

  • New pre-conditioner of TD-FEM

  • FDTD H-field normalization refactor

  • FDTD meshing improvements

  • Alphabetical sorting of sim tree nodes

  • Zoom to select sim object

  • Addition of rename and delete hotkeys. (F2 for remain and Delete for delete)

Start Now

Take a closer look at these new functions and performance improvements in the Solving Electromagnetic Challenges webinar “Ansys EMC Plus and Ansys Charge Plus: 2025 R2 What’s New.” Click here to watch.

EMA uses these tools to solve tough questions in product design. We are available to support your projects from beginning to end. For more on our consulting services, reach out to us by clicking here.

EMA maintains Charge Plus. It is available exclusively through Ansys. To learn more, click here.

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