Next-Generation Plasma Simulation Tool Sets new Industry Standard
Electro Magnetic Applications, Inc. (EMA) submitted a patent application (PCT/US25/51404) for its 3D CAD-integrated simulation platform that models plasma discharges.
“The patent filing reflects EMA’s commitment to pushing the boundaries of multiphysics simulation,” EMA Co-CEO Tim McDonald said.
This invention enables engineers and researchers to model, design, and analyze plasma systems directly within a unified 3D CAD environment.
Why is Plasma Simulation So Challenging?
Researchers use plasma simulation to understand and optimize plasma processes, such as plasma enhanced chemical vapor deposition (PECVD) in semiconductor manufacturing. Traditionally, scientists model the behavior of electrons, ions, and other carriers with particle-in-cell (PIC) methods. This method requires solving electromagnetic equations and fluid dynamics, including the Navier-Stokes equations.
PIC methods demand extremely small time steps to accurately track particle motion. In addition, plasma features like Debye length and sheaths are tiny, requiring a fine computational grid. These requirements make the simulation computationally intensive and often impractical for real-world problems.
Making the Impossible Practical
Fig. 1. EMA plasma simulation model.
Unlike existing plasma simulation tools that rely on complex meshes and fragmented solvers, EMA’s technology integrates multiphysics solvers, including electromagnetic, particle, fluid, and chemical reaction models into a seamless interface. The tool enables users to apply larger time steps across multiple radio frequency (RF) cycles and allows for bigger computational cell sizes.
“It allows us to have fewer cells that we’re modeling and it takes an impossible problem and makes it practical to solve,” McDonald says.
This technology makes it possible for engineers to solve industrially relevant problems in 3D. For example, semiconductor manufacturers can now predict angular and energy distributions of ions reaching the chip using real geometry and actual process flows.
“We believe that 3D is required for modeling all the processes that are happening in these chambers so that you understand the non-uniformities,” McDonald explains. “You can optimize your techniques so that you can improve your yield and increase the performance of your manufacturing.”
What’s Next for Plasma Simulation
EMA continues to enhance the performance of this technology. McDonald says EMA is automating problem setup and enabling rapid parameter variation. Engineers will also be able to run simulations on high-performance computing (HPC) and GPU platforms, allowing them to iterate more quickly and analyze results faster. Additionally, this technology will work with EMA3D Connect to use machine learning to automate model setup and provide real-time feedback, streamlining the path from initial design to full-wave simulation results.
“By integrating plasma simulation directly into the 3D design process, we’re reducing complexity and enabling faster, more accurate innovation across industries that rely on plasma technologies spanning from semiconductors to industrial processes, and aerospace,” McDonald said.
This patent marks a significant advancement in simulation technology by enhancing productivity and making sophisticated simulation capabilities more accessible and efficient than ever before.
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