Transformative Electromagnetic Simulation Trends for 2026
The use of electromagnetic (EM) simulation is surging, transforming the future of innovation.
The EM simulation market hit $1.51 billion in 2025 and is projected to rocket to $2.45 billion by 2030. Rising demand for consumer electronics and advanced technology, driven by automation and innovation, is fueling growth. A simulation-driven approach streamlines product development by enabling quick evaluations of design performance under varied conditions.
As we head into 2026, these simulation trends are refining design speed and reliability:
- AI/ML
- GPU acceleration
- Digital twins
- Multiphysics integration
Trend #1: AI/ Machine Learning
Artificial intelligence (AI) and machine learning (ML) are transforming EM simulation by introducing faster, smarter workflows.
ML techniques, especially surrogate models, are being applied with exceptional accuracy and speed. These models allow engineers to perform rapid optimization and design iterations for complex components in a fraction of the time compared to traditional methods. Programs like EMA3D Connect, leverage ML algorithms to handle parameterized and non-parameterized designs, reducing setup time and enabling predictive modeling without exhaustive datasets.
Learning from simulation data and design patterns, ML systems can anticipate performance outcomes, guide design decisions, and even suggest improvements, making electromagnetic simulation more efficient, scalable, and accessible across industries.
Trend #2: GPU Acceleration
GPU acceleration is reshaping EM simulation by dramatically reducing computation times for large and complex models.
Traditional CPU-based solvers are often slower when computing electrically large systems, such as full-vehicle EMC analysis or high-frequency antenna arrays, due to the sheer number of mesh elements and iterative calculations required. Multi-GPU architecture parallelizes these tasks, enabling simulations that once took days to be completed in just hours.
Ansys EMC Plus and Ansys Charge Plus exemplify this trend, offering GPU acceleration on Windows and Linux. Single GPU acceleration on a gaming desktop shows four-to-eight times speedups compared to typical CPU simulation.
This capability is critical for industries like automotive and aerospace, where electromagnetic compatibility (EMC) and interference (EMI) must be validated across entire systems. GPU acceleration not only improves speed but also scales computational resources dynamically, making high-fidelity electromagnetic analysis easily accessible to engineering teams.
Trend #3: Digital Twins
Digital twin technology is becoming a staple in EM simulation by enabling real-time monitoring and predictive insights throughout a product’s lifecycle. A digital twin is a virtual replica of a physical system that continuously updates using sensor data and simulation models. In electromagnetic applications, this means engineers can track performance under varying conditions, predict failures, and optimize maintenance schedules without costly physical testing.
Simulation-driven digital twins are particularly valuable in industries like automotive, aerospace, and industrial robotics, where complex electromagnetic environments affect reliability and safety. Coupled with reduced-order models (ROMs), which compress full 3D simulations into lightweight, high-speed representations, digital twins allow near-instant analysis for design of experiments and uncertainty quantification. EMA3D Connect uses capabilities to accelerate development and support advanced use cases such as predictive maintenance, system-level optimization, and integration with IoT platforms for continuous feedback loops.
Trend #4: Multiphysics Integration
Modern electromagnetic simulation is increasingly embracing Multiphysics integration in a unified workflow. This approach is essential for accurately predicting real-world performance, especially in complex systems. Advanced solvers enable co-simulation across domains, allowing engineers to evaluate how electromagnetic fields influence temperature rise, material stress, and even vibration under operational loads.
Ansys Charge Plus combines electromagnetic, fluid, and particle physics solvers for accurate Multiphysics simulation. This allows for complete simulation of electrostatic discharge (ESD), surface charging, internal charging, dielectric breakdown, charge accumulation.
Multiphysics workflows enable faster innovation, improved durability, and greater confidence in final designs. Ultimately, it transforms simulation from a single-domain tool into a comprehensive decision-making platform that drives efficiency and competitive advantage.
Now Is The Time To Act
The future of electromagnetic simulation is being shaped by AI/ML for smarter workflows, GPU acceleration for unprecedented speed, digital twins for real-time insights, and Multiphysics integration for design validation. These innovations are redefining how engineers approach complex challenges in automotive, aerospace, electronics, and beyond. Staying ahead means adopting tools and strategies that deliver accuracy, efficiency, and scalability.
Leverage these advancements by reaching out to EMA today and discover how our solutions, EMA3D Connect, Ansys EMC Plus, and Ansys Charge Plus, help you gain a competitive edge. Contact us by clicking here.
