Revolutionizing Plasma Simulation with CAD-Integrated Technology

LAKEWOOD, Colorado- Electro Magnetic Applications, Inc. (EMA) has filed an international patent application (PCT/US25/51404) covering a 3D CAD-integrated simulation platform for plasma discharges.

The invention enables engineers and researchers to model, design, and analyze plasma systems directly within a unified 3D CAD environment.

“The patent filing reflects EMA’s commitment to pushing the boundaries of multiphysics simulation,” EMA Co-CEO Tim McDonald said.

Unlike existing plasma simulation tools that rely on complex meshes and fragmented solvers, EMA’s technology integrates multiphysics solvers, including electromagnetic, particle, fluid, and chemical reaction models into a seamless interface. This integration accelerates simulation workflows and reduces computational overhead, making advanced plasma modeling accessible to a wide range of industries.

“By integrating plasma simulation directly into the 3D design process, we’re reducing complexity and enabling faster, more accurate innovation across industries that rely on plasma technologies spanning from semiconductors to industrials, and aerospace,” McDonald said.  

This patent marks a significant advancement in simulation technology by enhancing productivity and making sophisticated simulation capabilities more accessible and efficient than ever before.

About Electro Magnetic Applications, Inc.: EMA® is a global leader in providing simulation, consulting, test, and measurement services in the technical areas of electromagnetic effects. Specific specialties include lightning direct and indirect effects, electromagnetic environmental effects (E3), electromagnetic interference and compatibility (EMI/EMC), spacecraft charging, radio frequency (RF) interference, installed antenna performance, and radar signature prediction. The company is one of the pioneers in using the finite difference time-domain (FDTD) method to solve challenging E3 problems for the aerospace market. Visit www.ema3d.com for more information.

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