Accelerating 3D Layout-Based PCB Analysis Using Charge Plus and EMC Plus
Topic:
Accelerating 3D Layout-Based PCB Analysis Using Charge Plus and EMC Plus
Presenter:
Tim McDonald, EMA Co-CEO
Abstract:
Modern electronic systems demand fast, accurate electromagnetic modeling that reflects real PCB layouts and component interactions. In this webinar, we’ll introduce powerful new EMA3D Connect capabilities included in EMC Plus and Charge Plus that dramatically streamline full-device electromagnetic analysis.
Attendees will see how users can directly import PCB and component data using the Ansys Electronics Database (EDB) format, preserving the full layout and stackup without converting designs to boundary-representation (BREP) CAD. Once imported, users can interactively view individual layers in 2D, filter by layers, components, and nets, and mesh the native geometry directly, reducing model preparation and meshing times by hundreds of times compared to traditional workflows.
We’ll also demonstrate how PCB layouts can be seamlessly merged with mechanical CAD, such as enclosures, and augmented with cables and other connections. The resulting model enables users to apply excitations, place probes, and analyze voltages and currents on traces, producing a complete system-level electromagnetic model for EMI/EMC and RF compatibility studies.
These transformational capabilities enable full-device models to be assembled in minutes instead of days or weeks. Join us to get a first look at these new features launching in EMA 2026 R1 in March 2026.
