PCBA Design Decisions and SI/EMC Consequences
Topic:
PCBA Design Decisions and SI/EMC Consequences
Presenter:
Ryan French, EMA Computational Signal Integrity Engineer
Abstract:
When creating a PCBA, designers have a tough task – they must balance size, cost, and performance requirements, all while delivering a product that passes signal integrity and EMC tests. The decisions made during this process can significantly affect signal noise, power noise, and problematic emissions.
Many designers follow design rules that are informed by previous experience, company policy, or rules-of-thumb learned from other engineers. While some common design rules are well-informed, in many cases these rules can make noise and emissions worse! From stackup creation to component routing, every decision has the potential to make debugging the product’s issues more difficult. There are, however, a few decisions that can ensure that the finished board minimizes deleterious effects.
In this webinar, we will look at two identical PCBA designs – one with good design decisions and another with poor decisions. By simulating these designs, the impact of these design decisions can be clearly demonstrated. We will cover power delivery network impedances, crosstalk, edge-launched emissions, and more. By the end of the webinar, designers should recognize how the smallest decisions can change the finished board’s behavior, as well as how EMA’s team of experts can help in the design process.
