Webinars
Take part in EMA’s Solving Electromagnetic Challenges webinar series, where you will learn how to overcome the most pressing issues in the industry. Whether it's adapting to new standards, adopting new technologies and methodologies, or optimizing your designs and workflows, Solving Electromagnetic Challenges will give you the edge you need to succeed.
Our next webinar is Wednesday, May 20, 2026
Accelerate Biomedical Compliance with EMI/EMC/ESD Simulation
For manufacturers of biomedical electronics, achieving EMI, EMC, and ESD compliance is rarely a straight path—it is an expensive, slow cycle of lab testing, failure analysis, redesign, and re‑test. As devices become more compact and the healthcare environment increasingly complex and electromagnetically contentious, traditional trial‑and‑error approaches to certification fall short in meeting development timelines and budgets.
This presentation examines why biomedical products are particularly vulnerable to failure, patient‑connected safety requirements, and evolving regulatory standards. We will explore how physics‑based electromagnetic simulation can fundamentally change and accelerate your workflow.
Join us on May 20 at 1 p.m. ET. Click here to register.
Speaker: John Twerdok
EMA VP of Business Development
Our presenter is John Twerdok, VP of Software Business Development at Electromagnetic Applications (EMA). In this role, John works closely with the Ansys Channel team in helping customers deploy simulation for solving complex electromagnetic problems. John previously was the Director of Acquisitions & GTM Partnerships at Ansys. His experience in engineering software also includes leading the North and South American sales & services team at Granta Design Ltd. – a Cambridge UK software company. He was Sr. Business Line Executive of Digital Simulation Products at Autodesk and held management positions at both Moldflow Corporation, and Swanson Analysis Systems, where he was responsible for developing enterprise accounts, managing worldwide channel partners, and developing complementary software partner programs. John holds a B.S and M.S. in Mechanical Engineering from Union College in Schenectady, NY. He is a founding member of the Technology Network Alliance which is a global consortium of computer-aided engineering experts.
