Take part in EMA’s Solving Electromagnetic Challenges webinar series, where you will learn how to overcome the most pressing issues in the industry. Whether it's adapting to new standards, adopting new technologies and methodologies, or optimizing your designs and workflows, Solving Electromagnetic Challenges will give you the edge you need to succeed.
Our next webinar is Wednesday, May 21, 2025
Full Vehicle Simulation for EMI/EMC
The automotive electronics market has grown dramatically over the past decade. Analysts estimate that 50% of the total vehicle cost will be onboard electronics by 2030!
Increasingly complex automotive systems have contributed to this growth - including electric powertrains, safety critical sensors, driver assist features, cameras, onboard displays, and communications/connectivity. The potential for these systems (and associated cabling) to become an emitter or victim of electromagnetic interference is a serious problem for engineers whose designs must meet industry standards.
This presentation will share a methodology for simulating full vehicle EMI/EMC and discuss a strategy for ensuring automotive electronics designs can pass regulatory testing.
Join us on May 21 at 1 p.m. ET/ 11 a.m. MT. Click here to get registered.
Speaker: John Twerdok EMA VP of Software Business Development John Twerdok is VP of Software Business Development at Electromagnetic Applications (EMA). In this role, John works closely with the Ansys Channel team in helping customers deploy simulation for solving complex electromagnetic problems. John previously was the Director of Acquisitions & GTM Partnerships at Ansys. His experience in engineering software also includes leading the North and South American sales & services team at Granta Design Ltd. – a Cambridge UK software company. He was Sr. Business Line Executive of Digital Simulation Products at Autodesk and held management positions at both Moldflow Corporation, and Swanson Analysis Systems, where he was responsible for developing enterprise accounts, managing worldwide channel partners, and developing complementary software partner programs. John holds a B.S and M.S. in Mechanical Engineering from Union College in Schenectady, NY. He is a founding member of the Technology Network Alliance which is a global consortium of computer-aided engineering experts.
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