Webinars
Take part in EMA’s Solving Electromagnetic Challenges webinar series, where you will learn how to overcome the most pressing issues in the industry. Whether it's adapting to new standards, adopting new technologies and methodologies, or optimizing your designs and workflows, Solving Electromagnetic Challenges will give you the edge you need to succeed.
Our next webinar is Wednesday, Feb. 25, 2026
Accelerating 3D Layout-Based PCB Analysis Using Charge Plus and EMC Plus
Modern electronic systems demand fast, accurate electromagnetic modeling that reflects real PCB layouts and component interactions. In this webinar, we’ll introduce powerful new EMA3D Connect capabilities included in EMC Plus and Charge Plus that dramatically streamline full-device electromagnetic analysis.
Attendees will see how users can directly import PCB and component data using the Ansys Electronics Database (EDB) format, preserving the full layout and stackup without converting designs to boundary-representation (BREP) CAD. Once imported, users can interactively view individual layers in 2D, filter by layers, components, and nets, and mesh the native geometry directly, reducing model preparation and meshing times by hundreds of times compared to traditional workflows.
We’ll also demonstrate how PCB layouts can be seamlessly merged with mechanical CAD, such as enclosures, and augmented with cables and other connections. The resulting model enables users to apply excitations, place probes, and analyze voltages and currents on traces, producing a complete system-level electromagnetic model for EMI/EMC and RF compatibility studies.
These transformational capabilities enable full-device models to be assembled in minutes instead of days or weeks. Join us to get a first look at these new features launching in EMA 2026 R1 in March 2026.
Join us on Feb. 25 at 1 p.m. ET. Click here to get registered.
Speaker: Tim McDonald
EMA Co-CEO
Tim McDonald, PhD is Co-CEO at EMA. He is a leading expert in electromagnetic modeling and simulation, specializing in multiphysics solutions for EMC, power systems, and space environments. As a key contributor at EMA, Inc., he drives innovation in computational electromagnetics, developing advanced techniques for interference analysis, plasma physics, and high-power effects. With extensive experience in EMC Plus and Charge Plus, Tim has helped engineers tackle complex challenges in aerospace, energy, and manufacturing. He is passionate about bridging the gap between ease of use and high-fidelity physics, enabling engineers to model real-world electromagnetic interactions with confidence. Tim regularly presents at industry conferences, sharing insights into the latest advances in simulation and design optimization.
