Webinars

Electro Magnetic Applications, Inc. (EMA) hosts the Solving Electromagnetic Challenges series to explore proven solutions, emerging technologies, and engineering best practices for tackling today's toughest electromagnetic design problems.


Our next webinar is Wednesday, Nov. 18, 2026

Talk to Your Simulation: Agent-Driven PCB EMC and Magnetron Plasma Workflows with EMA3D Connect Plus

Setting up a simulation takes more engineering time than solving it. A PCB has to be imported, nets selected, meshed, and instrumented with sources and probes. A multiphysics study has to pass fields from one solver to the next without a lost unit or a flipped sign. Each step usually means a different GUI, a folder of files, and results assembled by hand.

EMA3D® Connect Plus exposes every public capability as a callable tool through an MCP server. Engineers bring the agent client and model their organization already approves, then describe the problem in plain language. The agent draws on EMA's engineering methods, which ship as skills, to set the study up the way EMA's own engineers would. It interviews the engineer before it acts and asks for confirmation before it commits an edit. No one clicks a button.

Join us for this webinar, where two EMA engineers show agent-driven setup on two very different problems.

  • Radiated emissions and susceptibility on a PCB. Watch an agent import a board, mesh it, raise the mesh resolution on request, and hand it to Ansys Discovery for EMC Plus. Then ask which traces are most likely to pick up crosstalk from a USB data pair. The agent reads the board, ranks the candidates by clearance and parallel run length, and places the sources and probes.
  • Ansys Maxwell to Ansys Charge Plus. See an agent build a magnetron magnet assembly in Maxwell through pyAEDT and run the magnetostatic solve. It then exports the B-field on a grid and uses it as the source for a plasma analysis in Charge Plus.
  • Learn how EMA methods are packaged as agent skills, including the failure signatures that come from real sessions, such as a coercivity sign that silently reverses a magnet or a field export in meters when the model is in millimeters.
  • Understand how the same problem definition can run on the full solver or on EMA's Physics AI surrogate, which returns shielding effectiveness up to 628x faster than the GPU solver.
  • Explore what you need to bring to try this yourself: your own agent client, your own approved model, and no customer data leaving your environment.

At the end of the webinar, attendees will have a clear picture of how agentic setup shortens the path from a design question to a trustworthy EMC or plasma result, and of how to start using it on their own problems.

Join us Nov. 18 at 1 p.m. ET.

Speaker: Gregory Wilson

EMA Senior Scientist

Gregory Wilson is a Senior Scientist at Electro Magnetic Applications, Inc. (EMA) where he specializes in space environment interactions with materials and spacecraft as well as electromagnetic effects of lightning and other high voltage phenomena. He has worked on numerous projects contracted by NASA, SpaceX, AFRL, and other space focused organizations.

Gregory received his Masters in Physics at Montana State University and his PhD at Utah State University with a focus on energetic electron interactions with Multilayer materials.

Gregory has published dozens of articles focusing on electron ranges in materials, secondary electron yield, surface voltage measurements, and other space based material characterization topics. He has recently worked on high fidelity electromagnetic simulations to understand the coupled interactions of surface and internal spacecraft charging. He is currently participating in the design and construction of EMA’s SERE facility as well as the development of Ansys Charge Plus (formerly EMA3D® Charge).

Patrick Campbell

EMA Scientist II

Patrick Campbell is a Scientist II at EMA. He attended Colorado School of Mines earning a B.S. in engineering physics and a non-thesis M.S. in data science.


View our previous webinars here:

airplane lightning environment

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Expanded cable harness

Ansys EMC Plus 2022 R1 What’s New

Topic: Ansys EMC Plus 2022 R1 What’s New Presenter: Tim McDonald, EMA President Abstract: This webinar will demonstrate the new capabilities and features added to EMA3D® Cable (now Ansys EMC Plus) 2022 R1 in this update: EMA3D® and Nexxim transient circuit co-simulation, new material property and cable libraries, and expanded cable harness connectivity features! Feature Updates Details: […]

discharges in the dielectric

Mitigating Electric Discharges with Ansys Charge Plus

Topic: Mitigating Electric Discharges with Ansys Charge Plus Presenters: Kevin-Druis Merenda, EMA Senior Scientist Abstract: Electric discharges are the release and flow of charge in a medium such as a gas or a solid. In the consumer electronics industry, discharges may be caused by the buildup of static electricity or by short-circuits. In the high-voltage […]

entire device simulation

Entire Device Simulation for Electromagnetic Compatibility

Topic: Entire Device Simulation for Electromagnetic Compatibility Presenter: Tim McDonald, EMA President Abstract: Learn how EMA3D® Cable (now Ansys EMC Plus) can help you meet your EMC regulations! With EMA3D® Cable, engineers can make PCB, cable, and enclosure design decisions with confidence in the accuracy of predictions to reduce risk going into EMI/EMC testing. Designers seek to […]

FDTD sub grid modeling

2021 R2 Ansys EMC Plus: Faster EMC Solving for Electronic Devices and Entire Vehicles

Topic: 2021 R2 Ansys EMC Plus: Faster EMC Solving for Electronic Devices and Entire Vehicles Presenter: Tim McDonald, EMA President Abstract: This webinar showcases how the new features in EMA3D® Cable (now Ansys EMC Plus) help you tackle Electromagnetic Interference (EMI) challenges including radiated emissions, radiated immunity, electrostatic discharge (ESD), and interference between systems integrated on […]

Cell phone simulation

Ansys EMC Plus 2021 R2: Electronics and Consumer Electronics

Topic: EMA3D® Cable (now Ansys EMC Plus) 2021 R2 What’s New: Electronics and Consumer Electronics Presenter: Tim McDonald, EMA President Abstract: EMA3D® Cable (now Ansys EMC Plus) is a robust electromagnetic compatibility (EMC) cable modeling solution for small electronic devices up to large complex platforms. EMA3D® Cable has recently been updated to include new features to accurately […]

Automotive EMC analysis

Simulation and Modeling Approaches Useful for Automotive EMC Analysis

Topic: Simulation and Modeling Approaches Useful for Automotive EMC Analysis Presenter: Karen Burnham, EMA Principal Scientist I Abstract: Failing automotive EMC requirements in the test lab leads to many extra costs and schedule delays. With the push for more electric vehicles (EVs), the electromagnetic environment in a car is getting harsher. With the advent of […]

HIRF Certification

Guide to Using Simulations for HIRF Certification Activities

Topic: Guide to Using Simulations for HIRF Certification Activities Presenter: Cody Weber, EMA Principal Scientist Abstract: Cody Weber reviewed the HIRF guidance documents AC20-158 and ARP5583 to understand which activities are typically performed for HIRF compliance demonstration. The webinar also covered how computational electromagnetic (CEM) simulations with EMA3D® can support HIRF design and compliance activities […]

Vehicle EMC requirements

How to Achieve Automotive EMC Certification Success at the First Pass

Topic: How to Achieve Automotive EMC Certification Success at the First Pass Presenters: Karen Burnham, EMA Principal Scientist I Flavio Calvano, Ansys Lead Application Engineer Abstract: Automotive systems are becoming more complex with each new technical development that is added to them. This increases the Electromagnetic Compatibility (EMC) challenges for the automotive platform. Passing EMC requirements is […]

RF system and cables simulation

Platform-Level Integration of Antennas, RF Systems, and Cables

Topic: Platform-Level Integration of Antennas, RF Systems, and Cables Presenters: Matt Miller, EMA Principal RF Engineer II Fred German, Ansys Director of R&D Abstract: Virtually every modern platform includes RF systems for a variety of functions including navigation, communication, surveillance and sensing. These RF systems are connected to antennas via cables routed through the vehicle […]

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