Entire Device Simulation for Electromagnetic Compatibility (EMC) Webinar
Learn how EMA3D® Cable can help you meet your EMC regulations!
With EMA3D® Cable, engineers can make PCB, cable, and enclosure design decisions with confidence in the accuracy of predictions to reduce risk going into EMI/EMC testing.
Designers seek to predict the emissions/immunity of products to meet regulatory or performance limits. EMC failure may be due to deficiencies in printed circuit boards (PCBs), enclosures, cables, grounding, bonding, or materials. Test failure does not always reveal the cause and occurs late in the development cycle. Entire unit enclosures are complex and expensive to model using legacy methods.
In this webinar we discussed the workflow of EMA3D® Cable, which allows import of near-field emissions from Ansys SIwave, Ansys HFSS, and pre-compliance measurement quickly. The workflow includes a co-simulation with a wire simulation code that allows for the considerations of small conductors, braided shields, and thin foils. EMA3D® Cable’s simulation workflow is rapid and relies on mechanical CAD with limited requirements to clean or prepare for simulation. This workflow allows EMC teams to evaluate all contributions to EMC of an electronic device early in a program development cycle.
Timothy McDonald, PhD, is President and Co-Owner of Electro Magnetic Applications, Inc. (EMA®) where he has implemented new system-modeling approaches to simulate the interaction of systems and their electronics with electromagnetic environments in a shorter time, with more accuracy, and at a lower cost. Tim currently serves as product manager for EMA3D® Cable. He supports EMA3D® Cable users around the world from multiple industries. Tim previously led consulting engagements for NASA and DoD major primes pertaining to specialty engineering of critical systems, development of novel solutions to electromagnetic compatibility problems, and in the execution of major programs that require verification to electromagnetic environmental effects.
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